[期刊论文] |
来源:Proceedings of the Canadian Engineering Education Association. 2008 ;0(0).
出版社:The Canadian Engineering Education Association (CEEA)
[期刊论文] |
出版社:The Canadian Engineering Education Association (CEEA)
[期刊论文] |
来源:Microprocessors and Microsystems. 2013 ;37(6-7):530-543.doi:10.1016/j.micpro.2013.07.002
出版社:Elsevier BV
[期刊论文] |
来源:Microprocessors and Microsystems. 2016 ;41:29-36.doi:10.1016/j.micpro.2015.12.005
出版社:Elsevier BV
[期刊论文] |
来源:Journal of Circuits, Systems and Computers. 2007 ;16(06):981-996.doi:10.1142/S0218126607004027
出版社:World Scientific Publishing
[期刊论文] |
来源:IET Computers & Digital Techniques. 2013 ;7(6):282-293.doi:10.1049/iet-cdt.2013.0017
出版社:Institution of Engineering and Technology (IET)
[期刊论文] |
来源:Microprocessors and Microsystems. 2009 ;33(5-6):343-355.doi:10.1016/j.micpro.2009.03.002
出版社:Elsevier BV
[期刊论文] |
来源:International Journal of Circuit Theory and Applications. 2011 ;39(6):557-572.doi:10.1002/cta.662
出版社:John Wiley & Sons, Ltd.
[期刊论文] |
来源:International Journal of Biometrics. 2023 ;1(1):1.doi:10.1504/IJBM.2023.10048651
出版社:Inderscience Publishers
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