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2056 条结果, 检索条件:( ( *(AU:("Yi He")) ) )

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[期刊论文]

Concentrating bounded states for a class of singularly perturbed Kirchhoff type equations with a general nonlinearity

作者:Yi He

来源:Journal of Differential Equations. 2016 ;261(11):6178-6220.doi:10.1016/j.jde.2016.08.034

出版社:Elsevier BV

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[期刊论文]

Chemical and diffusion-controlled curing kinetics of an underfill material

作者:Yi He

来源:Microelectronics Reliability. 2005 ;45(3-4):689-695.doi:10.1016/j.microrel.2004.08.013

出版社:Elsevier BV

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[期刊论文]

Rapid thermal conductivity measurement with a hot disk sensor

作者:Yi He

来源:Thermochimica Acta. 2005 ;436(1-2):122-129.doi:10.1016/j.tca.2005.06.026

出版社:Elsevier BV

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[期刊论文]

Heat capacity, thermal conductivity, and thermal expansion of barium titanate-based ceramics

作者:Yi He

来源:Thermochimica Acta. 2004 ;419(1-2):135-141.doi:10.1016/j.tca.2004.02.008

出版社:Elsevier BV

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[期刊论文]

Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications

作者:Yi He

来源:Thermochimica Acta. 2005 ;439(1-2):127-134.doi:10.1016/j.tca.2005.09.016

出版社:Elsevier BV

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[期刊论文]

Rapid thermal conductivity measurement with a hot disk sensor

作者:Yi He

来源:Thermochimica Acta. 2005 ;436(1-2):130-134.doi:10.1016/j.tca.2005.07.003

出版社:Elsevier BV

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[期刊论文]

Moisture absorption and hygroscopic swelling behavior of an underfill material

作者:Yi He

来源:Thermochimica Acta. 2012 ;546:143-152.doi:10.1016/j.tca.2012.07.016

出版社:Elsevier BV

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[期刊论文]

Thermal characterization of overmolded underfill materials for stacked chip scale packages

作者:Yi He

来源:Thermochimica Acta. 2005 ;433(1-2):98-104.doi:10.1016/j.tca.2005.02.020

出版社:Elsevier BV

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[期刊论文]

Synthesis, crystal structures and properties of two copper(II) 2-aminomethylbenzimidazole complexes

作者:Yi He

来源:Transition Metal Chemistry. 2003 ;28(4):464-467.doi:10.1023/A:1023684904291

出版社:Springer Nature

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[期刊论文]

DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors

作者:Yi He

来源:Thermochimica Acta. 2002 ;392-393:13-21.doi:10.1016/S0040-6031(02)00065-5

出版社:Elsevier BV

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